Low Coarsening Reverse Yakabatwa Copper Foil

Senge reverse-yakagadziriswa copper foil, ichi chigadzirwa chine nani etchability kuita.Inogona kunyatso kupfupisa maitiro ekugadzira, kuwana kumhanya kwepamusoro uye nekukurumidza micro-etching, uye kugadzirisa chiyero chekuenderana kwePCB.

Tumira email kwatiri

Product Detail

Product Tags

Detail

●Ukobvu: 12um 18um 35um 70um
●Standard Width: 1290mm, tinogona kuita kucheka sezvinodiwa saizi
●Wooden box package
●ID: 76 mm, 152 mm
●Kureba: Yakagadzirwa
●Sample inogona kupihwa
●Nguva yekufambisa: 15-30days
●Nguva: FOB, CIF...
●Kubhadhara chinhu: 50% T / T dhipoziti, bhari mubhadharo usati watumirwa.

Features

●Reverse yakagadziriswa foil yemhangura
●Low profile, ine high peel simba
●Iyo yakagadziriswa foil ndeyepingi
●Senge reverse-yakagadziriswa copper foil, ichi chigadzirwa chine nani etchability kuita.Inogona kunyatso kupfupisa maitiro ekugadzira, kuwana kumhanya kwepamusoro uye nekukurumidza micro-etching, uye kugadzirisa chiyero chekuenderana kwePCB.

Application

●High frequency, Ultra -high frequency, kushandisa kuPPE board
●Fine circuit pattern
●Inonyanya kushandiswa mumapuranga ane multilayered uye high-frequency boards.

Yakajairika Zvinhu zveLow Coarsening Reverse Yakabatwa Copper Foil

Classification			Unit	Zvinodiwa				Test Method
Nominal ukobvu			um	12	18	35	70	IPC-4562A
Area Weight			g/m²	107±5	153±7	285± 10	585± 20	IPC-TM-650 2.2.12
Kuchena			%	≥99.8				IPC-TM-650 2.3.15
Ruhu	Shiny side (Ra)		um	3.0				IPC-TM-650 2.2.17
	Matte side (Rz)		um	≤5.0	≤6.0	≤8.0	≤10
Tensile Simba	RT(23°C)		Mpa	≥276				IPC-TM-650 2.4.18
	H.T.(180°C)			≥138
Elongation	RT(23°C)		%	≥4	≥4	≥8	≥12	IPC-TM-650 2.4.18
	H.T.(180°C)			≥3	≥4	≥4	≥4
Simba rePeel(FR-4)			N/mm	≥1.0	≥1.2	≥1.4	≥1.8	IPC-TM-650 2.4.8
			Lbs/in	≥5.7	≥7.4	≥8.0	≥10.2
Pinholes & porosity			Numbers	No				IPC-TM-650 2.1.2
Anti-oxidization		RT(23°C)	Mazuva	90
		H.T.(200°C)	Maminitsi	30