5G Electrolytic Copper Foil
●Ukobvu: 12um 18um 35um
●Upamhi: 300-1300mm.stadnard hupamhi 1290mm, inogona kucheka sezvinodiwa saizi
●Wooden box package
●ID: 76 mm, 152 mm
●Kureba: Yakagadzirwa
●Sample inogona kupihwa
●Delivery: 10-20days
●Slitting Working Procedure: Ita kucheka, kurongedza, kuongorora uye pasuru zvinoenderana nezvinodiwa zvemhando, hupamhi uye huremu hwemhangura foils yevatengi.
●Ultra-yakaderera mbiri, ine yakakwira peel
●Simba uye yakanaka etchability
●Hyper yakaderera coarsening tekinoroji
●5G High frequency board
●LCP/MPI/MTPI
Classification | Unit | Zvinodiwa | Test Method | ||||
Foil Designation |
| T | H | 1 | IPC-4562A | ||
Nominal ukobvu | um | 12 | 18 | 35 | IPC-4562A | ||
Area Weight | g/m² | 107±5 | 153±7 | 285± 10 | IPC-TM-650 2.2.12 | ||
Kuchena | % | ≥99.8 | IPC-TM-650 2.3.15 | ||||
Ruhu | Shiny side (Ra) | um | ≤0.43 | IPC-TM-650 2.2.17 | |||
Matte side (Rz) | um | 1.0 | optical nzira | ||||
Tensile Simba | RT(23°C) | Mpa | ≥300 | IPC-TM-650 2.4.18 | |||
H.T.(180°C) | ≥180 | ||||||
Elongation | RT(23°C) | % | ≥5 | ≥6 | ≥8 | IPC-TM-650 2.4.18 | |
H.T.(180°C) | ≥6 | ≥6 | ≥6 | ||||
Simba rePeel(FR-4) | N/mm | ≥0.6 | ≥0.6 | ≥0.6 | IPC-TM-650 2.4.8 | ||
Lbs/in | ≥3.4 | ≥3.4 | ≥3.4 | ||||
Pinholes & porosity | Numbers | No | IPC-TM-650 2.1.2 | ||||
Anti-oxidization | RT(23°C) | Mazuva | 90 |
| |||
H.T.(200°C) | Maminitsi | 40 |
Standard Width, 1295 (±1) mm, Upamhi siyana: 200-1340mm.May maererano nemutengi chikumbiro musoni.